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CM1421 4-Channel LCD EMI Filter Array plus 4-Channel ESD Protection Array
Features
* * * * * * * Functionally and pin compatible with CMD's CSPEMI607 Four channels of combined EMI/RFI filtering plus ESD protection Four additional channels of ESD-only protection Better than 30dB attenuation (typical) at 1 GHz 15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) OptiguardTM coated for improved reliability Lead-free version available
Product Description
The CM1421 is a multichannel array consisting of four low-pass filters with integrated ESD protection and four ESD-only protection channels designed to reduce EMI/ RFI emissions on LCD data lines in mobile handsets. The CM1421 has component values of 15pF-10015pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, beyond the maximum requirement of the IEC 61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1421 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CM1421 incorporates OptiguardTM coating which results in improved reliability. The CM1421 is available in space-saving, low-profile chip-scale packages with optional lead-free finishing.
* * *
Applications
* * * * * LCD data lines in mobile handsets EMI filtering and ESD protection for both data and I/O ports Mobile Handsets Handheld PCs / PDAs Notebook Computers
Electrical Schematic
100 FILTER+ESDn* 15pF 15pF FILTER+ESDn* ESDn* 15pF
GND (Pins B1-B3)
1 of 4 EMI/RFI + ESD Channels.
1 of 4 ESD-only Channels
* See Package/Pinout Diagram for expanded pin information
(c) 2004 California Micro Devices Corp. All rights reserved. 04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1421
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW
(Bumps Up View)
1 A B C
2
3
4
5
6
ESD_3 FILTER+ESD_2 FILTER+ESD_4
C1
C2
FILTER+ESD_1
C3
GND
C4
FILTER+ESD_3
C5
GND
C6
ESD_4
N213
Orientation Marking
GND ESD_1
B1 A2
FILTER+ESD_1
B2 A4
FILTER+ESD_3
B3 A6
ESD_2
FILTER+ESD_2
FILTER+ESD_4
A1
A1
A3
A5
Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1421-03
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD_1 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_2 GND ESD_3 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Pins 15 Package CSP Number1 CM1421-03CS Part Marking N213 Lead-free Finish Ordering Part Number1 CM1421-03CP Part Marking2 N213
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
04/27/04
CM1421
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50, ZLOAD=50 At 2.5V DC IDIODE=10A VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 Notes 2,4 and 5 6.8 -0.8 9.0 -0.4 V V kV kV CONDITIONS MIN 80 12 5.5 100 TYP 100 15 MAX 120 18 UNITS pF V nA
VESD
30 15
Notes 2,3,4 and 5 +12 -7 R=100 , C=15pF 120
VCL
V V MHz
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2004 California Micro Devices Corp. All rights reserved. 04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1421
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1)
(c) 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
04/27/04
CM1421
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2)
(c) 2004 California Micro Devices Corp. All rights reserved. 04/27/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1421
Performance Information (cont'd)
Figure 5. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
04/27/04
CM1421
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A)
50m 20m
60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2004 California Micro Devices Corp. All rights reserved. 04/27/04
Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1421
Mechanical Details
CSP Mechanical Specifications CM1421 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B2 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.600 0.394 Nom 2.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.670 0.445 Max 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.739 0.495 Min Custom CSP 15 Inches Nom Max 0.1148 0.1165 0.1183 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.0091 0.0110 0.0236 0.0264 0.0291 0.0155 0.0175 0.0195 3500 pieces
A2
C2
B A 1 2 3 4 5 6
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
D1 D2
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1421 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM1421 CHIP SIZE (mm) 2.96 X 1.33 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W
Ko
Bo
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 9. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
04/27/04

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